Multifunctional memory cells

ABSTRACT

The present disclosure includes multifunctional memory cells. A number of embodiments include a gate element, a charge transport element, a first charge storage element configured to store a first charge transported from the gate element and through the charge transport element, wherein the first charge storage element includes a nitride material, and a second charge storage element configured to store a second charge transported from the gate element and through the charge transport element, wherein the second charge storage element includes a gallium nitride material.

PRIORITY INFORMATION

This application is a Continuation of U.S. application Ser. No.16/134,603, filed on Sep. 18, 2018, which is a Continuation of U.S.application Ser. No. 15/641,736, filed Jul. 5, 2017, and issued as U.S.Pat. No. 10,176,870 on Jan. 8, 2019, the contents of which are includedherein by reference.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memory andmethods, and more particularly, to multifunctional memory cells.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits and/or external removable devices in computers orother electronic devices. There are many different types of memoryincluding volatile and non-volatile memory. Volatile memory can requirepower to maintain its data and can include random-access memory (RAM),dynamic random access memory (DRAM), static random access memory (SRAM),and synchronous dynamic random access memory (SDRAM), among others.Non-volatile memory can provide persistent data by retaining stored datawhen not powered and can include NROM flash memory, NAND flash memory,NOR flash memory, read only memory (ROM), and resistance variable memorysuch as phase change random access memory (PCRAM), resistive randomaccess memory (RRAM), magnetic random access memory (MRAM), andprogrammable conductive memory, among others.

Memory devices can be utilized as volatile and non-volatile memory for awide range of electronic applications in need of high memory densities,high reliability, and low power consumption. Non-volatile and/orvolatile memory may be used in, for example, personal computers,portable memory sticks, solid state drives (SSDs), digital cameras,cellular telephones, portable music players such as MP3 players, andmovie players, among other electronic devices.

Memory cells in an array architecture can be programmed to a target(e.g., desired) state. For instance, electric charge can be placed on orremoved from the charge storage structure (e.g., floating gate) of afield effect transistor (FET) based memory cell to program the cell to aparticular data state. The amount of stored charge on the charge storagestructure of an FET-based memory cell can be indicated by a resultingthreshold voltage (Vt) state of the cell.

For example, a single level memory cell (SLC) can be programmed to atargeted one of two different data states, which can be represented bythe binary units 1 or 0. A binary data state represents 1 bit of datawith 2′ (e.g., 2) data states. As an additional example, some memorycells can be programmed to a targeted one of more than two data states,such as, for instance, to a targeted four bits of data with 2⁴ (e.g.,16) data states (e.g., 1111, 0111, 0011, 1011, 1001, 0001, 0101, 1101,1100, 0100, 0000, 1000, 1010, 0010, 0110, and 1110). Such cells may bereferred to as multi state memory cells, multiunit cells, or multilevelcells (MLCs). MLCs can provide higher density memories withoutincreasing the number of memory cells since each cell can represent morethan one digit (e.g., more than one bit), and therefore can provide highdata storage capacity.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram that illustrates an example of an apparatus inaccordance with an embodiment of the present disclosure.

FIG. 2A illustrates a schematic of an NROM memory cell forimplementation in a multifunctional memory cell in accordance with anembodiment of the present disclosure.

FIG. 2B illustrates a schematic of NAND memory cells for implementationin a multifunctional memory cell in accordance with an embodiment of thepresent disclosure.

FIG. 3 illustrates a portion of a multifunctional memory cell inaccordance with an embodiment of the present disclosure.

FIG. 4 illustrates a portion of a multifunctional memory cell inaccordance with an embodiment of the present disclosure.

FIG. 5 illustrates a portion of a multifunctional memory cell inaccordance with an embodiment of the present disclosure.

FIG. 6 illustrates a portion of a multifunctional memory cell inaccordance with an embodiment of the present disclosure.

FIG. 7 illustrates a portion of a multifunctional memory cell inaccordance with an embodiment of the present disclosure.

FIG. 8 illustrates a memory array having multifunctional memory cells inaccordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes multifunctional memory cells. A numberof embodiments include a gate element, a charge transport element, afirst charge storage element configured to store a first chargetransported from the gate element and through the charge transportelement, wherein the first charge storage element includes a nitridematerial, and a second charge storage element configured to store asecond charge transported from the gate element and through the chargetransport element, wherein the second charge storage element includes agallium nitride material.

Memory cells in accordance with the present disclosure can have thecharacteristics (e.g., performance characteristics) and/or attributes ofboth a less non-volatile (e.g., volatile) memory cell and a non-volatilememory cell within the framework of a single cell. For example, memorycells in accordance with the present disclosure can simultaneouslyfunction (e.g., operate) as both less non-volatile and non-volatilememory cells. Such memory cells can be referred to herein asmultifunctional memory cells.

Multifunctional memory cells in accordance with the present disclosurecan be used to functionally replace traditional memory cells, such astraditional SRAM, DRAM, and/or flash (e.g., NROM and/or NAND flash)memory cells, used in previous memory devices. For example,multifunctional memory cells in accordance with the present disclosurecan have a single memory cell design that can be utilized in a singlememory array and single logic circuitry design, while simultaneouslymeeting the performance characteristics and/or attributes of traditionalSRAM, DRAM, and/or flash memory arrays previously provided throughdifferent cell, array, and logic circuitry designs.

For example, multifunctional memory cells in accordance with the presentdisclosure can function as high speed memory, such as, for instance, forcaching and/or for storage of central processing (e.g., CPU) functions,while simultaneously functioning as high capacity memory, such as, forinstance, for working memory storage and/or for large capacity filestorage (e.g., for operating systems and/or apps). In contrast, previousmemory devices may utilize different types of volatile and non-volatilememory cells, with different array and logic circuitry designs, toachieve such functionality. For instance, previous memory devices mayutilize SRAM and/or DRAM cells for higher speed functionality, whileutilizing flash memory cells for long-duration (e.g., file) storagefunctionality.

As such, memory devices that utilize multifunctional memory cells inaccordance with the present disclosure can have a lower cost, consumeless power, and/or have a higher performance than previous memorydevices that utilize different types of memory cells to separatelyachieve volatile and non-volatile functionality. Further,multifunctional memory cells in accordance with the present disclosurecan be multilevel cells (MLCs), thereby achieving high storage densityand/or capacity. Further, multifunctional memory cells in accordancewith the present disclosure can be configured in planar arrays (e.g.,planar channel FET-based) that may be vertically stackable in athree-dimensional memory array and/or alternatively may be configured invertical planes (e.g., vertical channel FET based) in the form ofthree-dimensional memory arrays.

In multifunctional memory cells in accordance with the presentdisclosure, the charges (e.g., electrons) used to program the cell toits various states may originate primarily from (e.g., be supplied by)the metal gate of the cell (e.g., instead of from the semiconductorsilicon substrate of the cell, as with other multifunctional memorycells), such that little or no electronic charge movement takes placeacross the interface between the silicon substrate and the gateinsulator stack of the cell. Such memory cells may be referred to hereinas reverse mode multifunctional memory cells. Although reverse modemultifunctional memory cells may be comparatively slower in theestablishment of their memory states than other non-volatile memory(NVM) cells, they may provide superior reliability since thesilicon-insulator interface of the cell remains relatively unperturbedduring programming and/or erasing.

Reverse mode multifunctional memory cells in accordance with the presentdisclosure may have enhanced attributes not available in convention NVMcells. For example, the multi-layered higher K dielectric materials ofthe cells may be designed to enable 1) energy efficient charge transportusing quantum mechanical direct tunneling, thereby achieving end of lifeprogrammability and durability; 2) band engineering for high speedcharge transport as well as charge blocking for leakage prevention,thereby simultaneously achieving higher performance (e.g.,functionality), larger memory window (e.g. MLC capability), andretention (e.g., non-volatility); and 3) effective charge trapping andstorage for aiding simultaneously functionality, MLC capability, andnon-volatility. Further, reverse mode multifunctional memory cells inaccordance with the present disclosure may be technology and integrationcompatible to scaled CMOS logic technology in a unified fabricationscheme.

Reverse mode multifunctional memory cells in accordance with the presentdisclosure may also overcome conventional NVM cell limitations throughstack designs and the above listed attributes, with further advancementof reliability and durability. It should also be noted that these stacksare directly compatible in an integration scheme with CMOS logic FETgates, and are also implementable in conventional one-transistor, and/or1.5 Transistor (e.g., split-channel) NROM cells with VGA array scheme,as well as in conventional NAND-Flash array designs.

As used herein, “a” or “an” can refer to one or more of something, and“a plurality of” can refer to more than one of such things. For example,a memory cell can refer to one or more memory cells, and a plurality ofmemory cells can refer to two or more memory cells.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits.

FIG. 1 is a block diagram that illustrates an example of an apparatus inthe form of an electronic system 100 in accordance with an embodiment ofthe present disclosure. System 100 can be, for example, a computersystem, a memory system, a hand-held device, a cell phone, etc. FIG. 1illustrates an example of a memory hierarchy associated with electronicsystem 100. In this example, the memory hierarchy may include levels L1to L5. As an example, levels L1 to L5 may be defined by memorycharacteristics (e.g., access speed, and/or cycle speed, and or the datathroughput, memory cell size, reliability, endurance, volatility,memory-window size, etc.). For example, in going from level L1 to levelL5, the access speed, and the cycle speed, and the data throughput mayprogressively decrease, while the nonvolatility and storage capacity ofthe memory type may increase.

Note that the data access speed, for example, may be related to the readaccess time of the memory that implies the time it takes to ensure thebinary (“1” or “0”) state of any particular memory bit within a memoryarray (e.g., the higher the access speed, the lower the access time).For example, the cycle time may imply the time it takes to not onlyestablish the binary memory state of any storage bit (either 1, or 0)through programming (“write” and or “erase”) of the specific bit withinthe memory array, but also the time to ensure the memory state which isthe access time. Memory delay (e.g., memory latency) may imply the timeit takes for the memory bit to arrive at the processor node once theprocessor fetches the memory bit triggered by a unit of a clock cycle ofthe processor, for example. Memory bandwidth (e.g., memory throughput),for example, may be related and inversely proportional to the memorylatency. The higher the memory bandwidth, for example, the lower thedelay and lower the memory cycle time. For example, the data throughputmay be inversely related to the data cycle time combined with the datatransfer time to the processor, where the data transfer time to theprocessor may be dependent on the design of the memory output system andthe transfer mode. Therefore, when memory with lower latency (e.g., alower cycle time) may be employed, for example, the processor mayexecute an assigned task (e.g. any specific function or program) fasterand the performance of a system (e.g., digital system) may be improved.

Memory volatility may be related to two aspects of retention of thememory state of any memory bit. One aspect of retention may be theretention of a memory state when the power is available to the memoryarray, implying that no re-writing (e.g., refreshing), such asre-establishing, the memory state is required during a time period. Thisaspect of retention may be longer for SRAM and shorter (in the order ofmilliseconds) for DRAM. Therefore, DRAM may require frequent refreshingof a memory state even when the power is on for the memory array. Theother aspect of memory retention, for example, may be the ability toretain a written (e.g., established) memory state of any bit when thereis no power to the memory array. Memory state retention of this typemight be about 10 years for some nonvolatile memories of some SSDs(NROMs or NAND types of memory cells) and HDDs (magnetic tapes ordisks).

When power is not available, for example, the memory states of SRAMs andDRAMs may be lost. Therefore, these types of memories may be classifiedas volatile memories. For conventional non-volatile memories, forexample, the lower the degree of volatility, the longer the memoryretains data, and thus the greater the retention. For example, SDDs may,in general, be less nonvolatile compared to HDDs, where HDDs couldretain data for centuries in a properly stored environment.Silicon-based non-volatile memories may vary significantly in memoryretention, depending on the memory type (NROM or NAND Flash), the memorycell attributes, and the detailed stack structure of the memory celldesign. Some memory cell designs of NROMs and NAND, for example, mayhave at least one year of nonvolatility for most of the applications forwhich such memories are employed.

For multifunctional non-volatile memories in accordance with the presentdisclosure that retain their memory states when power is lost, thedegree of non-volatility may vary by many orders of magnitude, and maydepend on the cycle time of the specific memory cell to functionallyreplace the conventional memory cells. Multifunctional memory cells inaccordance with the present disclosure are based on charge trappingelements integrated into a gate stack insulator structure within theframework of an FET-based cell. For instance, a multifunctional memorycell in accordance with the present disclosure designed to replacesimultaneously an L3 (conventional DRAM) functionality and L5 (HDD)functionality may be designed to store memory states within the cell for1E2 seconds and 1E9 seconds (e.g., nearly 50 years) for L3 and L5functionality simultaneously, even when there is no power to the memorycell. In similar cases, conventional DRAM volatile memory will not holdmemory states when power is lost, but HDD will maintain its state.

Another important property of memory, for example, may be the number oftimes memory binary states may be “written” or altered or “programmed”during the life time of the electronic system. In some examples,systems, such as memory systems, may be assumed to last for about 10years, during which some memory bits may be altered for as many asthousand trillion times (1E15 times). The SRAMs and DRAMs, might, forexample, withstand such re-programming known as “endurance.” Endurancelimits of some NROMs, for example, may be about 10 million times, whilethose of some NAND flash memories may be about 100,000 times to aboutone million times. This may limit the application of current NROMs andNANDs for L1, L2, and L3 memory applications, besides theirsignificantly slower cycle time compared to SRAMs and DRAMs.

Electronic system 100 may include a processor 102, such as amicroprocessor, that may control electronic system 100. Processor 102may include a memory 104, such as a logic memory, having a memory levelL1. For example, a conventional L1-level memory may be an SRAM volatilememory. Processor 102 may also include a memory 106, such as a cachememory, that may have a memory level L2, for example. In some examples,processor 102 may include a built-in memory management unit (MMU) notshown in the drawing. In some examples, the MMU (not shown) may becoupled to L2 and other memory levels. An example of a conventionalL2-level memory may be an SRAM volatile cache memory.

Advantages of SRAM may include, for example, high performance (e.g.,high data throughput), and high endurance required for L1/L2-levelfunctionality, and ease of fabrication (e.g., that may be compatiblewith complementary-metal-oxide-semiconductor (CMOS) fabricationtechniques). Disadvantages of SRAM may include, limiting memorycapacity, due, for example, to relatively large memory cell sizes (e.g.,with a form factor F×F of about 50 to about 80) and volatility.

Memory 106 may be coupled to a memory 108, as shown in FIG. 1. Memory106 may also be coupled to a memory 110, and memory 110 may be coupledto memory 108, for example. As used in the examples herein, the term“coupled” may include directly coupled and/or directly connected with nointervening elements (e.g., by direct physical contact) or indirectlycoupled and/or connected with intervening elements, such as an MMU (notshown).

Memory 110 may be a main memory (e.g., a working memory) and may have amemory level L3. An example of a conventional L3-level memory may be aDRAM volatile memory. Advantages of DRAM, for example, may includerelatively higher performance compared to non-volatile memories (e.g.,read, write, and erase times of less than about 10 nanoseconds),relatively small (e.g., an F×F of about 6 to about 8)one-transistor-one-capacitor memory cells, yielding higher capacity, andrelatively higher performance with lower cycle time to provide L3-levelfunctionality. DRAM, for example, may provide relatively high enduranceat the expense of power consumption for frequent refreshing of thememory states. Disadvantages of DRAM may include, for example,fabrication (e.g., customized CMOS fabrication for the capacitor may berequired), scalability (e.g., may be difficult to scale to below 30nanometers), and volatile memory cells (e.g., data may need to berefreshed about every millisecond).

Memory 108 may be a storage memory (e.g., for storing data and/or code)and may have a memory level L4. Examples of L4-level memory may includenon-volatile NOR memory, non-volatile NAND memory, and non-volatileNROM. In some examples, memory 108 may be referred to as a solid-statememory.

Advantages of NROM (e.g., NROM flash) may include, for example,relatively high read performance (e.g., fast reads), non-volatile memorycells, relatively small (e.g., an F×F of about 6)random-access-one-transistor memory cells, multiple-bit-per cell storagecapability, basic-input/output-system (BIOS) functionality, code storagecapability, and fabrication (e.g., compatible with CMOS fabricationtechniques). Disadvantages of NROM may include, for example, relativelyslow writes, relatively high programming voltages, relatively lowread/write endurance, and relatively poor durability.

Advantages of NAND (e.g., NAND flash) may include, for example, small(e.g., an F×F of about 4) one-transistor memory cells with single-bit-and multiple-bit-per cell storage capability, non-volatile memory cells,and high storage capacity per mm² of silicon. Disadvantages of NAND mayinclude, for example, relatively slow write speeds (e.g., about 1.0 toabout 10 millisecond), relatively slow access (e.g., serial/parallelmemory access), and relatively low write/erase (W/E) endurance (e.g.,about 10³ to about 10⁵ W/E cycles).

Memory 110 may be coupled to a memory 112, having a memory level L5, forexample. Examples of conventional L5-level memories may include magneticmemory (e.g., magnetic tapes) and/or optical memory (e.g., opticaldiscs) for storing data. In some examples, memory 112 may be referred toas an HDD memory. Advantages of magnetic memory may include, forexample, non-volatility, high-density storage, low cost, high capacity,and L5-level functionality. Disadvantages of magnetic memory mayinclude, for example, speed (e.g., long access and cycle times),relatively poor reliability, and moving mechanical parts.

A memory hierarchy, such as that described above, may advantageouslyemploy, for example, the memories described above, such as the L1- toL5-level memories (e.g., SRAM, DRAM, NROM, NAND, and HDD) to fulfillsystem functionality objectives with cost, capability, power,performance, form-factor, portability, and applications in mind. Thehierarchy may require communication between various memories and,therefore, for example, may disadvantageously involve a significantamount of peripheral logic, power, cost, performance compromises,form-factor constraints, reliability issues, and durability issues.This, for example, may suggest a “one-type-fits-all” approach to memorydesign (e.g., a novel one-type-fits-all memory). Except for HDD, someprocessors and memories may (e.g., all) be silicon based, and the memorycell structure may (e.g., all) be similar and may be built using scaledCMOS field-effect transistor technology, for example.

There may be a need for memories that may include silicon-basednon-volatile one-transistor memory cells that may simultaneously satisfythe speed, power, and/or durability requirements of L2-, L3-, andL4-level memories. Such a memory cell may be referred to herein as amultifunctional memory cell. There may be a need to extend thereliability and durability of such a memory cell while preserving otherattributes of multifunctional memory cells. Such a memory cell may bereferred to herein as a reverse-mode multifunctional memory cell. Theremay be a need to provide reverse-mode multifunctional memory cellswhereby gate stack integration for CMOS scaled logic FETs are madesimpler.

There may be a need for memories with multifunctional capability tomaintain their information or data when there is a loss of power. Theremay be a need for memories to simultaneously store the shorter retentiondata for end-of-life storage within the same memory cell. There may be aneed, for example, to do away with the conventional memory hierarchy(e.g., in favor of a non-hierarchical organization) that may result infaster communication with the processor. There may be a need, forexample, to have such a memory with integration compatibility withscaled CMOS logic technology and ease of fabrication with a conventionprocessing scheme. Such a memory may be referred to herein asreversed-mode silicon based-unified multifunctional memory, orreverse-mode MSUM memory.

There may also be a need to extend the MSUM memory cell capability toprovide higher capacity of data storage within the memory cell in orderto achieve MLC capability. There may also be a need for a memory cell tooperate in reverse-mode to extend durability. Such a memory cell designmay be referred to herein as a reverse-mode MLC MSUM cell.

Embodiments of the present disclosure include memory that may include,for example, non-volatile memory cells in which an active element, suchas a field-effect transistor, may be integrated with a dielectric stackthat can store a charge in the gate stack of the field-effecttransistor. The gate stack may control the entire transistor channel orpart of the transistor channel in the memory cell design. In someexamples, such a memory might be referred as MSUM. In some examples, thedesign of the dielectric stack may be varied to incorporate L4 or L5level MLC storage capacity. Such a memory cell might be referred as MLCMSUM. In some examples, the design of the dielectric stack may be variedso that the non-volatile memory cell (e.g., a MSUM memory cell) mayoperate simultaneously as a L2-, L3-, L4-, or L5-level memory cell. Forexample, the memory cells disclosed herein may have higher performance,lower power consumption, and higher reliability than, for example, someconventional NVM cells. Employing such a memory cell in the framework ofsub-arrays and arrays may eliminate the need of conventional memoryhierarchy, thereby improving memory and system attributes.

In some examples, field-effect-transistor- (e.g., FET-) basedreverse-mode MSUM devices in accordance with the present disclosure maybe designed to achieve different functionality, dependent on intrinsicdielectric stack characteristics of a design, by adding or subtractingdielectrics in the dielectric stack. Reverse-mode MSUM technology may beseamlessly integrated with the CMOS logic technology, for example,unlike conventional memories, such as DRAM, that may have uniquecustomized integration requirements. MSUMs may be differentiated by theattributes of their charge transport, charge storage, and chargeretention (e.g., charge blocking) characteristics. For example, theintrinsic memory-cell attributes may be different in terms ofprogramming speed, power, and refresh requirements that may result incycle-time variations, variations in data throughput and systemcapability, and differing applicability to replace conventional memoriesby functionality.

In some examples, some reverse-mode MSUM memory cells in accordance withthe present disclosure may have a programming peak field lower than 8MV/cm, which may be significantly lower than that for conventional NVMs.Additionally, some reverse-mode MSUM memory cells in accordance with thepresent disclosure may only require charge injection from the gateduring programming, keeping the silicon-insulator interface passive withno energy transfer at the interface during programming of the cell.Consequently, in some examples, memory durability (e.g., programmingendurance) could significantly enhance and match those of volatile SRAMand DRAM memories, thereby enabling functional replacements of volatilememories in digital systems not currently feasible by conventional NROMsand NAND flash based SSDs.

Some DRAMs may operate at 1.5 Volts, and may need to be refreshed aboutevery 10 milliseconds. However, some reverse-mode MSUMs in accordancewith the present disclosure may need to be refreshed (e.g.,reprogrammed) only about every 100 to 1000 seconds. Further, some DRAMmemory cells, for instance, may require twice as much area as somereverse-mode MSUMs in accordance with the present disclosure.

In various examples of the present disclosure, reverse-modeMSUM-memory-cell fabrication may be compatible withcomplementary-metal-oxide-semiconductor (CMOS) fabrication techniques.This may allow, for example, the dielectric stack to be fabricated to adesired memory level (L2, L3, L4, or L5) with a minimal number ofadditional processing steps. Moreover, the reverse-mode MSUM memorycells may be scalable to about a five-nanometer feature size. Forexample, such scaling may be difficult for conventional DRAM designs.

Reverse-mode MSUM memory cells in accordance with the present disclosuremay be implemented (e.g., in scaled silicon) using, for example, CMOSlogic technology and a set of unified and complimentary integrationschemes that may eliminate some separate, custom-integration technologypractices, such as those currently employed for DRAM (e.g., for L3), andNROM (for code, BIOS, etc.) and NAND-flash (e.g., for L4) memory chips.Additionally, custom interface logic and packaging may be required forcommunication between the processor and between different levels andtechnology-specific types of memories within the previous hierarchicalmemory systems. Reverse-mode MSUM memory cells in accordance with thepresent disclosure may (e.g., only) add or subtract specific selecteddielectrics (e.g., as thin films) in the gate stack design in a unifiedprocess integration methodology with the scaled CMOS logic technology toenable functionality equivalence from L2 through L5. This maypotentially have, for example, multiple benefits, such as a) technologycompatibility, b) productivity, c) enhancement in technologyreliability, and d) reduction (e.g., elimination) of interfacingtechnology and packaging between different memory types and betweenlogic and memories. For example, potential benefits at the system levelmay include not only process complexity reduction, but also, costreduction, power reduction, and enhancements in performance, andreliability. Additional potential benefits may include a reduction intest cost and component product assurance cost both at a memory leveland a system level.

Multiple and wide-ranging memory cell performance and associated datathroughput from the memory array may be built into the same reverse-modeMSUM cell design with complementary Input/Output logic built into theassociated memory array. For example, this may be achieved byintegrating dielectric films with well-defined intrinsic attributes intothe dielectric stack design of an MSUM memory cell while using a similar(e.g., the same) technology integration scheme. This may provide, forexample, certain functionality and memory capability within a singlememory array design that may not be feasible for conventional memories.

MSUMs, for example, may allow for similar memory cell designs and arrayarchitectures throughout the memory hierarchy that may provide aspectrum of cycle time, latency targets, and data throughput to delivervarying functionality and durability requirements that might be balancedfor certain applications. Due to the process commonality, MSUM-celldesigns might be implemented in different capacity arrays and orsubarrays within a single chip or multiple chips to address system cost,power, form-factor, performance, and durability objectives. This mayprovide more flexibility in system design, for example.

Some reverse-mode MSUM memory cell designs in accordance with thepresent disclosure, for example, may employ an energy-efficient directtunneling mechanism to achieve desired system performance andfunctionality. Some reverse-mode MSUM memory cell designs in accordancewith the present disclosure may extend the direct tunnel mechanismfurther through internal field enhancements using appropriately selectedmulti-layered direct tunneling dielectric films with progressiveband-energy offsets coupled with multi-step direct tunneling. Forexample, this approach may allow additional voltage scalability withhigher programming speed for the memory cells, and, consequently, powersavings at the desired performance level, that may be difficult toachieve using conventional memories and hierarchical memory designs ofcomparable performance and applicability.

Band-engineered reverse-mode MSUM memory cells, for example, may employstack design and tailored programming to establish targetedspeed-retention tradeoffs towards achieving the system data-ratethroughput (L2/L3/L4 functionality) for effective execution offunctions. For example, this approach may reduce data transmissiondelays, and thus increase data availability, at appropriate processingnodes, reduce pre-fetch data storage requirements, reduce machine cycletime for execution of functions, reduce data refresh requirements,reduce complexity in bus design, etc.

Reverse-mode MSUM memory cell designs in accordance with the presentdisclosure may provide, for example, unique sets of functionalattributes via dielectric stack designs for FET based charge-trap memorycells. For example, the reverse-mode MSUM memory cell and array designmay have the potential to create superior digital systems with flexibledesign attributes within the framework of a unified technology andmemory cell and array designs and yet with versatile functionality tobroaden application base not cost-effective with current conventionalapproaches.

Reverse-mode MSUM memory cell designs in accordance with the presentdisclosure may provide, for example, unique memory sub-arrays, arrays,and/or sub-systems with specific attributes within the framework of aunified scaled CMOS technology, by incorporating or eliminating certaindielectric layers in the gate stack design of the memory cell. Suchversatility may not be available in conventional memory cell and arraydesigns. These memory sub-system attributes for reverse-mode MSUMs withgreater durability may include, for example, 1) cost optimized MSUMdesigns for L2/L3/L4, 2) power optimized MSUM designs for L2/L3/L4, 3)cost and performance optimized MSUM designs for L1/L2/L3/L4, 4)performance optimized (e.g., high performance) MSUM designs forL1/L2/L3/L4, and 5) capacity optimized (e.g., MLS) MSUM designs forL1/L2/L3/L4, plus MLC.

FIG. 2A illustrates a schematic of an NROM memory cell 214 forimplementation in a multifunctional memory cell in accordance with anembodiment of the present disclosure. FIG. 2B illustrates a schematic ofNAND memory cells 240 for implementation in a multifunctional memorycell in accordance with an embodiment of the present disclosure.

As previously described herein, reverse-mode MSUM cells in accordancewith the present disclosure can be implemented in the form of either 1)a two-transistor NROM cell with one fixed Vt transistor in series withan NV-transistor with MSUM characteristics sharing a common diffusionmode, or 2) a split gate (or split channel) implementation of the memorycell of form 1 whereby the fixed Vt element acts as the access gate andis integrated with the variable Vt NVM element which acts the controlgate. Together the access gate and control gate can control the channeland set the memory thresholds or the memory states. For instance, theaccess gate can be designed to set the erase state for the memory celland perform “over-erasure” protection for the memory, and the controlgate can be programmed to define the programmed (e.g., written) statesfor the cell (e.g., “1” for 1 bit binary state, “01, 10, 11” for a DLCproviding 2-bits per cell storage, “001, 010, 100, 110, 101, 011, 111”for a TLC providing 3-bits per cell storage, etc.). The integrated twodevice memory cell may be referred to herein as a 1.5 T NVM cell.

A schematic of an example configuration of such a cell is illustrated inFIG. 2A. The type of NROM cell illustrated in FIG. 2A can be used forMLC-NROMs because it can provide over-erasure protection andconsequently tight distribution of the erase memory state (e.g., “0”,“00”, or “000” for 1 bit, 2 bit, or 3 bit storage, respectively) for thememory array.

As shown in FIG. 2A, NROM cell 214 may be adjacent to (e.g., over) asemiconductor 216, such as P-type (e.g., P⁻-doped) silicon substrate.Source/drains 218 (e.g., n⁺-type or n⁻-type diffusion regions) may be insemiconductor 216. NROM cell 214 can include a split gate structure(e.g., access gate element 220 and overlapping control gate element228), and a stack having a charge blocking element 222, charge storage(e.g., trap) element 224, and an interface metallic layer 226, asillustrated in FIG. 2A. Examples of the gate, charge storage element,charge blocking element, and interface layer will be further describedherein.

FIG. 2B illustrates a schematic representation of a planar NAND memorystring 230, which can be used for high capacity storage. For example, asmany as 256 bits could be serially stored within such a NAND stringwhere the bits are accessed serially. The NAND string can provide thehighest memory density for all memory cells, at the expense ofperformance since the memory cells need to be accessed serially withineach string.

As shown in FIG. 2B, NAND string 230 can include a number of NAND cells240 adjacent to (e.g., over) a semiconductor 232, such as P-type (e.g.,P⁻-doped) silicon substrate. Source/drains 234 (e.g., n⁻-type diffusionregions) may be in semiconductor 216 to form source line 236 and bitline 238, respectively. As illustrated in FIG. 2B, each respective NANDcell 240 can include a stack comprising, among other elements, a chargestorage (e.g., trap) element 242, examples of which will be furtherdescribed herein. Further, NAND string 230 can include a bit line selectgate 244 (to select the specific NAND string) on one end and asource-line select gate 244 at the other end adjacent to source/drains234, as illustrated in FIG. 2B.

Embodiments of the present disclosure, however, are not limited to thespecific designs illustrated in FIGS. 2A and 2B. Rather, reverse-modeMSUM concepts in accordance with the present disclosure could beapplicable to all types of memory cells previously described herein byincorporating their unique stack designs to provide simultaneousmulti-functionality. Further, as previously described herein, allreverse-mode MSUM cells described herein are implementable with commonscaled CMOS technology.

In all reverse-mode MSUM cell designs to be described herein, tantalumnitride (TaN) may be used as the metallic interface to the gate topartially control the threshold of the device. Further, in all SUMdesigns, the equivalent oxide thickness (EOT) of the logic FETs (bothPFET and NFET) may be set by the interface dielectric at the substrateend and the final blocking element of the SUM stack at the metal end.The intermetallic TaN material may be chosen to set the work-functionfor the logic FETs as well as the MSUM devices, and may be common toboth logic and memory devices for all cases.

In all reverse-mode MSUM cell designs to be described herein, thesimultaneous multi-functionality may be adjusted and simultaneously, theprogram performance (e.g., cycle) time could be adjusted by optimizingthe programming pulse scheme. Although the stack designs describedherein may be either cost-focused, power-focused, capacity-focused,performance-focused, or cost/performance-focused designs, the attributesof the designs could be altered and tailored for specific applicationsby altering the thickness of particular elements (e.g., layers) shown,eliminating particular elements, and/or adding additional (e.g.,optional) layers for tunneling, trapping, and/or blocking functions.

Further, reverse-mode MSUM cell designs described herein may include aless non-volatile charge storage element, and a non-volatile chargestorage element. As used herein, a “less non-volatile” charge storageelement of the multifunctional cell can be a charge storage element thathas a functionality level that is lower than the functionality level ofthe volatile charge storage element of the cell. For example, the lessnon-volatile charge storage element may have volatile levelfunctionality, and as such may also be referred to as a volatile chargestorage element.

The gate stack designs of all reverse-mode MSUM cell designs to bedescribed herein may have a commonality of interface materials (e.g.,layers) both at the silicon/insulator interface as well as thegate-insulator/gate-metal interface. The first interface dielectriclayer may be an ultra-thin layer of oxygen-rich silicon oxynitride(OR—SiON) to control the interface state density, equivalent to silicondioxide (SiO₂). For the insulator/gate metal interface, a common layerof intermetallic TaN can be used to control the work function for anylogic FET device or SUM memory device.

Further, the gate stack designs of all reverse-mode MSUM cell designs tobe described herein may use integration compatible dielectric materials(e.g., layers) for both scaled FET devices and certain elements fornon-volatile memory devices. The integration may be straight forward byusing, for example, the FET gate insulator processing sequence ofcombining OR—SiON and a blocking material of, for example, hafniumlanthanum oxynitride (HfLaON), deposited in the defined active regionsduring processing, which can become sequential and yield the gateinsulator stack design for the scaled FET devices. In terms of processintegration, this approach may provide a simple integration schemebetween the logic and memory devices.

The integration scheme for the gate stack designs of all reverse-modeMSUM cell designs to be described herein may include a charge transportelement (e.g., tunnel layers) adjacent the gate, charge trapping and/orstorage elements adjacent the charge transport element, and a chargeblocking element (e.g., blocking layers) adjacent the charge trappingand/or storage elements and the silicon substrate. This may be a reverseorder from other multifunctional memory cells, in which the tunnellayers may be adjacent the silicon substrate and the blocking layers maybe adjacent the gate. Accordingly, the active source of charges forreverse-mode memory cells in accordance with the present disclosure maybe the gate (e.g., instead of the silicon substrate, as with othermultifunctional memory cells), with the silicon-interface remainingpassive during programming.

Various embodiments of reverse-mode MSUM memory cells will be furtherillustrated and described herein. However, embodiments of the presentdisclosure are not limited to these examples, with other possibilitiesexisting for such cell designs providing simultaneous multiplefunctionality within the same cell, multi-level storage, and enhanceddurability. The illustrated cells may be direct tunnel charge trappingFET-based memory cells, and may be used in NROM VGA arrayimplementations and/or NAND flash array implementations. However, insome embodiments, performance-focused designs may be employed in NROMarrays and capacity-focused designs may be employed in NAND arrays,depending on application objectives.

All reverse-mode MSUM memory cells described herein may operate asdirect tunnel memories, and their enhanced attributes can be derivedfrom band engineered gate stack designs employing appropriate propertiesof high K dielectric materials for tunneling, trapping, storing, andreducing (e.g., minimizing) stored charge losses. All embodiments mayexhibit end-of-life endurance with peak fields ≤8.2 MV/cm, which may besignificantly below the programming field used for conventional NVMs.The programming voltage may be either +/−5 V or +/−7V, which may be lessthan half the programming voltage typically employed in conventional NVMdevices. Embodiments are designed for a 1.5 V power supply consistentwith feature-size scaled technology below 30 nm. The FET EOT for allembodiments may be in the range of 1.8 to 2.3 nm.

For all reverse-mode MSUM memory cells described herein, programming(e.g., writing) may be done by applying a −Vpp on the gate, whichinjects electron into the gate dielectric layers. Erasing can beaccomplished by imposing positive potential to the gate, therebyremoving the electrons from the trapping dielectric and returning themback to the gate. Shallower traps may include either a nitride layer ora silicon oxynitride (Si₂ON₂) layer. The Si₂ON₂ layer may provide longerrefresh time for L2 and L3 functionality due to somewhat deeper trappingdepth compared to nitride. For L4/L5 functionality, deeper galliumnitride (GaN) trapping can be employed closer to the silicon-insulatorinterface, which enables larger memory window and longer retention. Allprogramming (e.g., writing and erasing) is done by direct tunneling,enabling end-of life endurance and lower Vpp and consequently a lowerenergy requirement for programming.

In MLC designs of the present disclosure, a thin layer of aluminum oxide(Al₂O₃) and storage layer, injector silicon-rich nitride (i-SRN),adjacent to the Al₂O₃ may be introduced to achieve enhanced retentiondue to creation of fixed negative charges at the Al₂O₃/i-SRN interface(due to alumino-silcate formation at the interface). This approach mayprovide significantly larger window and enhanced retention enabling DLCand TLC capabilities for charges stored in deep offset traps of GaN. Forprogramming flexibility, some cell designs may use multiple thinlaminates of shallow (e.g. nitride) and deep traps (e.g. GaN) spaced atsuccessively longer distances. This approach can enable L2/L3/L4programming performance and memory window design flexibility byutilizing the energetics of trapping and de-trapping.

FIG. 3 illustrates a portion of a multifunctional memory cell 346 inaccordance with an embodiment of the present disclosure, designed forlow power, high performance simultaneous L2 and L3 functionality, withoptional simultaneous extendibility to L4 functionality. For example,FIG. 3 illustrates a partial energy band diagram of the gate stackstructure of a reverse-mode multifunctional memory cell 346. Cell 346can be, for instance, a five unique layer low power, high performancememory cell that can provide L2 and L3 functionality, while consuming arelatively low amount of power during operation (e.g., during programand/or erase operations performed on the cell). In an embodiment, cell346 can comprise a stack that includes a charge blocking element havingan OR—SiON material and an HfLaON material, a non-volatile chargestorage element having a GaN material and an i-SRN material for extendedcharge storage, a nitride less non-volatile charge storage element, anda charge transport (e.g., tunnel) element having an HfLaON material, afirst nitride material, a first i-SRN material, a second nitridematerial, and a second i-SRN material, as will be described herein.

As shown in FIG. 3, cell 346 can include a substrate element 360, acharge blocking element 356 adjacent (e.g., in direct contact with)substrate element 360, a non-volatile charge storage element 354adjacent charge blocking element 356, a less non-volatile charge storageelement 352 adjacent non-volatile charge storage element 354, a chargetransport (e.g., tunneling) element 350 adjacent less non-volatilecharge storage element 352, and a gate element 348 adjacent chargetransport element 350. Substrate element 360 can be, for example, asilicon material (e.g., a silicon substrate), and gate element 348 canbe an insulator-metal interface material (e.g., layer) such as, forinstance, tantalum nitride (TaN) or titanium nitride (TiN).

Less non-volatile (e.g., DRAM) charge storage element 352 can be anitride material, which can provide stability and a large retentionwindow, while having a shallow trap depth to enhance detrapping andincrease the speed of erase operations performed on cell 346.Non-volatile (e.g., flash) charge storage element 354 can include afirst non-volatile charge storage material 370, and a secondnon-volatile charge storage material 368, as illustrated in FIG. 3.First material 370 can be a GaN material, which can provide a hightrapping density (e.g., greater than 10¹³ per square centimeter), andsecond material 368 can be a silicon-rich nitride material, such as, forinstance, an injector silicon-rich nitride material, to further enhancecharge storage (e.g., the memory window) for the flash memoryfunctionality. GaN material 370, i-SRN material 368, and nitridematerial 352, can have thicknesses of 3 nanometers (nm), 2 nm, and 1.5nm, respectively, with a combined equivalent oxide thickness (EOT) of2.34 nm.

As shown in FIG. 3, charge blocking element 356 can include a firstmaterial 374 and a second material 372. First material 374 can be anOR—SiON material that can provide interface stability with substrateelement 360 by controlling the interface state density. As an example,oxygen-rich silicon oxynitride material 374 can be a high-K materialhaving a composition of N/N+O of approximately 0.18 and an atomicconcentration of oxygen in the range of 50-60%, and can be fabricatedusing low-pressure chemical vapor deposition, atomic layer deposition,or thermal/plasma oxidation/nitridation techniques, for instance. Secondmaterial 372 can be a thermally stable, low leakage hafnium oxynitridematerial, such as a hafnium lanthanum oxynitride (HfLaON) material, ahafnium aluminum oxynitride (HfAlON) material, a hafnium tantalumoxynitride (HfTaON) material, or a hafnium silicon oxynitride (HfSiON)material, for instance. Such a material can be a trap free dielectricthat has low conductivity and a high-K value that can result in a lowequivalent oxide thickness (EOT). Further, such a material can have highthermal and structural stability, and high breakdown strength. OR—SiONmaterial 374 and HfLaON material 372 can have thicknesses of 1 nm and 5nm, respectively, with a combined EOT of 1.8 nm.

In the example illustrated in FIG. 3, charge transport element 350includes a first material (e.g., first layer) 366, a second material(e.g., second layer) 364-2, a third material (e.g., third layer) 362-2,a fourth material (e.g., fourth layer) 364-1, and a fifth material(e.g., fifth layer) 362-1. First material 366 can be a hafniumoxynitride material (e.g., the same type of hafnium oxynitride materialas material 372), second material 364-2 and fourth material 364-1 canboth be a nitride material, and third material 362-2 and fifth material362-1 can both be a silicon-rich nitride material (e.g., an injectorsilicon-rich nitride material). The transport of charge through chargetransport element 350, and the benefits of utilizing such materials incharge transport element 350, will be further described herein. HfLaONmaterial 366 can have a thickness of 3 nm, nitride materials 364-2 and364-1 can both have thicknesses of 1 nm, and i-SRN materials 362-2 and362-1 can both have thicknesses of 2 nm, with a combined EOT ofapproximately 1.5 nm for charge transport element 350. However, higherperformance L2 functionality can be obtained by reducing the thicknessof HfLaON material 366 to 1.5-2.0 nm.

The combined total EOT for the stack comprising charge blocking element356, non-volatile and less non-volatile charge storage elements 354 and352, and charge transport element 350 can be, for instance, less than orequal to 6.5 nm. This embodiment can be a low power (e.g., Vpp of +/−5V, peak programming field of 7.7 MV/cm) design, as previously described.Further, all materials of the stack could be deposited with the samelow-pressure chemical vapor deposition tool. For integration, the firsttwo materials 374 and 372 (e.g., OR—SiON and HfLaON) can be deposited onactive device regions of silicon for both logic and memory devices.Subsequently, the memory regions (e.g., for the deposition ofnon-volatile and less non-volatile charge storage elements 354 and 352)can be opened while the rest of the silicon remains masked, and allother dielectric materials can be deposited selectively on the activememory cell regions. After the gate stacks are all in place, andsource/drain processing are completed, TaN and the metal gate can bedeposited over the logic FET device regions and the memory gate regionsat the same time.

During operation of cell 346, such as, for instance, during a programoperation being performed on cell 346, a charge, such as, for instance,an electron, may be transported from gate element 348 through chargetransport element 350 (e.g., through materials 362-1, 364-1, 362-2,364-2, and 366) to either less non-volatile charge storage element 352or non-volatile charge storage element 354 (e.g., to GaN material 370).For instance, a program operation performed on cell 346 can includeapplying a program (e.g., write) voltage (+/−Vpp) to cell 346, andwhether the charge is transported to less non-volatile charge storageelement 352 or non-volatile charge storage element 354 during theprogram operation may depend on the duration for which the programvoltage is applied to the cell. The charge may be transported throughcharge transport element 350 by, for instance, direct tunneling throughcharge transport element 350. The charge can then be trapped and storedby the charge storage element to which it has been transported, andcharge blocking element 356 can prevent the stored charge from leakingwhile it is being stored.

As an example, programming can be done by applying −Vpp on the gate ofcell 346, which injects an electron(s) into the gate dielectric layers.The electron gets injected from the metal gate and almost instantly, thegate potential is transferred to the interfacing i-SRN materials 362-1and 362-2. The i-SRN materials get flooded with electrons with directtunneling of charges within that medium. As a result, the materials'conductivity is raised by many orders of magnitude, and it changes intoa nearly conductive layer. The −Vpp without any significant potentialdrop gets transferred into the i-SRN materials. Thus, the i-SRNmaterials can act almost as an extension of the potential imposed on thegate and can provide silicon nanocrystals as injecting centers,injecting electrons into the gate dielectric. Subsequently, electronstunnel through nitride materials 364-1 and 364-2 and HfLaON material366, and get trapped into the shallower trapping centers in nitridematerial 352. As the programming proceeds, additional electrons getstored into the i-SRN material 368 between the nitride and GaN trappingmaterials 352 and 370, as well as into the deeper trap depths of GaNmaterial 370. This accomplishes “writing” to the higher threshold state.

For erase operations, +Vpp may be applied to the gate, and band bendingmay be reversed. For instance, the trapped electrons tunnel back to thegate by direct tunneling when short pulses of +Vpp are applied to thegate. This can enable L2 functionality. With a longer pulse duration,charges trapped in GaN material 370 may get detrapped, aided by theadjacent i-SRN storage material 368. This can enable L3 functionality.The low EOT design and lower programming voltage thus providesimultaneously L2 and L3 functionality by storing charges respectivelyin nitride traps and GaN traps.

In an embodiment, simultaneous L2/L3/L4 functionality can be achieved byincreasing the thickness of GaN material 370 to approximately 5-6 nm.For a longer programming pulse duration (e.g., L4 programming), traps ofGaN material 370 further from the gate will be filled, whereas, forshorter pulse durations (e.g., L3 programming), only traps closer to thegate will be filled. A special pulse sequence for L3 programmingcomprising a −Vpp/+0.7 Vpp, storing part of the GaN charges in thein-SRN material closer to the gate, may be needed, but the L2programming may remain unaffected. For increased performance ofsimultaneous L2/L3/L4 functionality, the nitride material 352 thicknessand the adjacent i-SRN storage material 368 may need a thicker trap forthe same i-SRN thickness with a thinner tunnel material.

FIG. 4 illustrates a portion of a multifunctional memory cell 476 inaccordance with an embodiment of the present disclosure, designed forlow cost, low power, simultaneous L3 and L4-L5 functionality. Forinstance, dual trapping of nitride for L3 and GaN for L4-L5 can be usedin the design illustrated in FIG. 4, and the low power may result fromoperability at Vpp=+/−5 V using enhanced charge injection into an HfSiONtunnel material (e.g., layer) from an i-SRN material. Further, the stackdesign may include dielectric materials such as OR—SiON and HfSiON forboth charge transport (e.g., tunneling) and blocking, which may beimplementable using low cost low-pressure chemical vapor deposition(LP-CVD) processing. Further, the stack design may utilize negativefixed charge associated with an Al₂O₃/i-SRN interface to establish alarge memory window and longer retention for L4 functionality.

For example, FIG. 4 illustrates a partial energy band diagram of thegate stack structure of a reverse-mode multifunctional memory cell 476.Cell 476 can be, for instance, a six unique layer low cost, low power,memory cell that can provide both L3 and L4-L5 functionality, whileconsuming a relatively low amount of power during operation (e.g.,during program and/or erase operations performed on the cell) and beingcheap and/or easy to process (e.g., fabricate). In an embodiment, cell476 can comprise a stack that includes a charge blocking element havingan OR—SiON material, an HfSiON material, an Al₂O₃ material, and an i-SRNmaterial, a GaN non-volatile charge storage element, a nitride lessnon-volatile charge storage element, and a charge transport (e.g.,tunnel) element having an HfSiON material and an i-SRN material, as willbe described herein.

As shown in FIG. 4, cell 476 can include a substrate element 488, acharge blocking element 486 adjacent (e.g., in direct contact with)substrate element 488, a non-volatile charge storage element 484adjacent charge blocking element 486, a less non-volatile charge storageelement 482 adjacent non-volatile charge storage element 484, a chargetransport (e.g., tunneling) element 480 adjacent less non-volatilecharge storage element 482, and a gate element 478 adjacent chargetransport element 480. Substrate element 488 can be, for example, asilicon material, and gate element 478 can be an insulator-metalinterface material (e.g., layer) such as, for instance, TaN or TiN.

Less non-volatile (e.g., DRAM) charge storage element 482 can be anitride material, which can provide stability and a large retentionwindow, while having a shallow trap depth to enhance detrapping andincrease the speed of erase operations performed on cell 476.Non-volatile (e.g., flash) charge storage element 484 can be a GaNmaterial, which can provide a high trapping density. GaN material 484and nitride material 482 can have thicknesses of 4 nm and 2 nm,respectively, with a combined EOT of approximately 2.3 nm.

As shown in FIG. 4, charge blocking element 486 can include a firstmaterial 499, a second material 498, a third material 496, and a fourthmaterial 494. First material 499 and second material 498 can be anOR—SiON material and a hafnium oxynitride material (e.g., HfSiON),respectively, having characteristics and benefits analogous to thosepreviously described for charge blocking element 356 in connection withFIG. 3. OR—SiON material 499 and HfSiON material 498 can havethicknesses of 1 nm and 4.55 nm, respectively, with a combined EOT of2.1 nm.

Third material 496 can be an Al₂O₃ material, and fourth material 494 canbe a silicon-rich nitride (e.g., i-SRN) material. These materials canreact at their mutual interface to provide a high density of fixednegative charge that can prevent charge loss to substrate 488 bycreating a repulsive electro-static field. This can provide a very largememory window and retention for L4 functionality. Al₂O₃ material 496 andi-SRN material 494 can have thickness of 1 nm and 2 nm, respectively,with a combined EOT of approximately 1 nm.

In the example illustrated in FIG. 4, charge transport element 480includes a first material 492 and a second material 490. First material492 can be a hafnium oxynitride material (e.g., the same type of hafniumoxynitride material as material 498), and second material 490 be asilicon-rich nitride material (e.g., i-SRN). The transport of chargethrough charge transport element 480, and the benefits of utilizing suchmaterials in charge transport element 480, will be further describedherein. HfSiON material 492 can have a thickness of 2.5 nm, and i-SRNmaterial 490 can have a thickness of 2 nm, with a combined EOT ofapproximately 1.3 nm for charge transport element 480.

The combined total EOT for the stack comprising charge blocking element486, non-volatile and less non-volatile charge storage elements 484 and482, and charge transport element 480 can be, for instance, less than orequal to 6.7 nm. This embodiment can be a low power (e.g., Vpp of +/−5V, peak programming field of 7.5 MV/cm) design, as previously described.Further, all materials of the stack could be deposited with the sameLP-CVD tool, in a manner analogous to that described in connection withFIG. 3.

During operation of cell 476, such as, for instance, during a programoperation being performed on cell 476, a charge (e.g., an electron) maybe transported from gate element 478 through charge transport element480 (e.g., through materials 490 and 492) to either less non-volatilecharge storage element 482 or non-volatile charge storage element 484.For instance, a program operation performed on cell 476 can includeapplying a program (e.g., write) voltage (+/−Vpp) to cell 476, andwhether the charge is transported to less non-volatile charge storageelement 482 or non-volatile charge storage element 484 during theprogram operation may depend on the duration for which the programvoltage is applied to the cell. The charge may be transported throughcharge transport element 480 by, for instance, direct tunneling throughcharge transport element 480. The charge can then be trapped and storedby the charge storage element to which it has been transported, andcharge blocking element 486 can prevent the stored charge from leakingwhile it is being stored.

As an example, programming can be done by applying −Vpp (e.g., −5 V) onthe gate of cell 476, which injects an electron(s) into the gatedielectric layers and on to i-SRN material 490, in a manner analogous tothat described in connection with FIG. 3. Subsequently, enhancedinjection of the electrons from i-SRN material 490 into HfSiON material492 can occur using the −5 V Vpp, which can allow for low poweroperability, as described herein, and the electrons may get trapped instorage materials 482 or 484, in a manner analogous to that described inconnection with FIG. 3. For erase operations, +Vpp (e.g., +5 V) may beapplied to the gate, band bending may be reversed, and the trappedelectrons can tunnel back to the gate, in a manner analogous to thatdescribed in connection with FIG. 3.

FIG. 5 illustrates a portion of a multifunctional memory cell 5001 inaccordance with an embodiment of the present disclosure, designed forlow cost, high performance, high capacity simultaneous L2, L3, and L4functionality with DLC or TLC capability. For instance, the cell designillustrated in FIG. 5 may be implementable in both NROM VGA and NANDflash memory cells, operable at Vpp=+/−7 V with an EOT of approximately8.5 nm for simultaneous functionality of L2/L3 and high capacity DLC orTLC L4 functionality. The cell design may include a progressive bandoffset (PBO) tunnel barrier that can achieve the low cost and highperformance objective, and can combine elements of the cells previouslydescribed in connection with FIGS. 3 and 4 both for functionality andhigh capacity.

For example, FIG. 5 illustrates a partial energy band diagram of thegate stack structure of a reverse-mode multifunctional memory cell 5001.Cell 5001 can be, for instance, a seven unique layer low cost, highperformance, high capacity memory cell that can provide simultaneous L2,L3, and L4 functionality with DLC or TLC capability, while being cheapand/or easy to process (e.g., fabricate) and performing at a high speed(e.g., having increased speeds for program and/or erase operationsperformed on the cell). In an embodiment, cell 5001 can comprise a stackthat includes a charge blocking element having an OR—SiON material, anHfLaON material, an Al₂O₃ material, and an i-SRN material, a GaNnon-volatile charge storage element, an additional non-volatile chargestorage element having a nitride material and an i-SRN material, a lessnon-volatile charge storage element having a nitride material and ani-SRN material, and a charge transport (e.g., tunnel) element having alanthanum oxide (La₂O₃) material, an HfLaON material, and an OR—SiONmaterial, as will be described herein.

As shown in FIG. 5, cell 5001 can include a substrate element 5015, acharge blocking element 5013 adjacent (e.g., in direct contact with)substrate element 5015, a non-volatile charge storage element 5011adjacent charge blocking element 5013, an additional non-volatile chargestorage element 5009 adjacent non-volatile charge storage element 5011,a less non-volatile charge storage element 5007 adjacent additionalnon-volatile charge storage element 5009, a charge transport (e.g.,tunneling) element 5005 adjacent less non-volatile charge storageelement 5007, and a gate element 5003 adjacent charge transport element5005. Substrate element 5015 can be, for example, a silicon material,and gate element 5003 can be an insulator-metal interface material(e.g., layer) such as, for instance, TaN or TiN.

As shown in FIG. 5, less non-volatile (e.g., DRAM) charge storageelement 5007 can include a first material 5023 and a second material5025. First material 5023 can be a nitride material that provides fastcharge trapping and de-trapping for the DRAM functionality, aspreviously described herein. Second material 5025 can be a silicon-richnitride material (e.g., i-SRN) to further enhance charge storage (e.g.,the memory window) for the DRAM functionality, i-SRN material 5025 andnitride material 5023 can have thicknesses of 2 nm and 1 nm,respectively, with a combined EOT of approximately 1.15 nm.

As shown in FIG. 5, non-volatile (e.g., flash) charge storage element5009 can include a first non-volatile charge storage material 5027, anda second non-volatile charge storage material 5029. First material 5027can be a nitride material that provides provide deeper charge trapping,and therefore, greater stability and a larger retention window, forflash functionality, and second material 5029 can be a silicon-richnitride material (e.g., i-SRN) to further enhance charge storage for theflash functionality. Further, non-volatile charge storage element 5011can be a GaN material, which can provide a high trapping density foradditional flash (e.g., L4) functionality. GaN material 5011, i-SRNmaterial 5029, and nitride material 5027, can have thicknesses of 4 nm,2 nm, and 1 nm, respectively, with a combined EOT of approximately 2.3nm.

As shown in FIG. 5, charge blocking element 5013 can include a firstmaterial 5037, a second material 5035, a third material 5033, and afourth material 5031. First material 5037 and second material 5035 canbe an OR—SiON material and a hafnium oxynitride material (e.g., HfLaON),respectively, having characteristics and benefits analogous to thosepreviously described for charge blocking element 356 in connection withFIG. 3. OR—SiON material 5037 and HfLaON material 5035 can havethicknesses of 1 nm and 5 nm, respectively, with a combined EOT of 1.8nm.

Third material 5033 can be an Al₂O₃ material, and fourth material 5031can be a silicon-rich nitride (e.g., i-SRN) material, havingcharacteristics and benefits analogous to those previously described forcharge blocking element 486 in connection with FIG. 4. Al₂O₃ material5033 and i-SRN material 5031 can have thickness of 1 nm and 4 nm,respectively, with a combined EOT of approximately 1.54 nm.

In the example illustrated in FIG. 5, charge transport element 5005includes a first material 5021, a second material 5019, and a thirdmaterial 5017. First material 5021 can be an La₂O₃ material to enhanceboth electron and hole tunneling, providing lower band offset for holetunneling. Second material 5019 can be a hafnium oxynitride material(e.g., the same type of hafnium oxynitride material as material 5035),and third material 5017 be an OR—SiON material that can provideinterface stability with gate element 5003.

Utilizing such materials for first material 5021, second material 5019,and third material 5017 can increase the speed and efficiency of chargetransport through charge transport element 5005 during program and/orerase operations (e.g., while an external field exists), whilemaintaining a low conductivity to prevent reverse transport of chargestored by charge storage elements 5007, 5009, and/or 5011 back throughcharge transport element 5005 (e.g., when the external field isremoved). Further, utilizing La₂O₃ for first material 5021 can allow forboth electron and hole tunneling, which can further increase the speedand efficiency of charge transport through charge transport element 5005during program and/or erase operations. The transport of charge throughcharge transport element 5005 will be further described herein.

La₂O₃ material 5021 can have a thickness of 3 nm, HfLaON material 5019can have a thickness of 2.5 nm, and OR—SiON material 5017 can have athickness of 1 nm, with a combined EOT of approximately 1.7 nm forcharge transport element 5005. Further, the combined total EOT for thestack comprising charge blocking element 5013, charge storage elements5011, 5009, and 5007, and charge transport element 5005 can be, forinstance, approximately 8.5 nm. The design of this embodiment can beoperable at Vpp=+/−7 V, with a peak programming field of 8.2 MV/cm.

During operation of cell 5001, such as, for instance, during a programoperation being performed on cell 476, a charge (e.g., an electron) maybe transported from gate element 5003 through charge transport element5005 (e.g., through materials 5017, 5019, and 5021) by enhanced directtunneling (e.g., PBO DTM) to less non-volatile charge storage element5007 (e.g., nitride material 5023), non-volatile charge storage element5009 (e.g., nitride material 5027), or non-volatile charge storageelement 5011. For instance, a program operation performed on cell 5005can include applying a program (e.g., write) voltage (+/−Vpp) to cell5005, and the charge storage element to which the charge is transportedduring the program operation may depend on the duration for which theprogram voltage is applied to the cell.

The charge may be transported through charge transport element 5005 by,for instance, tunneling through charge transport element 5005. Forexample, charge transport element 5005 can be a triple layer PBO tunnelbarrier that can provide internal field-aided enhanced electrontransport, and the charge may tunnel through the PBO tunnel barrier viadirect electron tunneling or hole tunneling. The charge can then betrapped and stored by the charge storage element to which it has beentransported, and charge blocking element 5013 can prevent the storedcharge from leaking while it is being stored.

When the gate polarity is reversed for erasing, enhanced hole tunnelingfrom the charge storage elements may take place through theabove-mentioned direct tunnel (PBO-DTM for holes) barriers transportingholes to both the less non-volatile charge storage element 5007 and thenon-volatile charge storage elements 5009 and 5011. Simultaneously,electrons from less non-volatile charge storage element 5007 and thenon-volatile charge storage elements 5009 and 5011 may be detrapped, andeither get compensated with incoming holes or tunnel back to gateelement 5003. This may significantly reduce erase time and cycle time,enhancing performance.

FIG. 6 illustrates a portion of a multifunctional memory cell 6039 inaccordance with an embodiment of the present disclosure, designed forlow cost, high capacity L2-L3 and L4-L5 (TLC) functionality. The designof memory cell 6039 illustrated in FIG. 6 may be similar to the celldesign described in connection with FIG. 4, except the charge transportelement may be a two-layer PBO tunnel barrier having an oxide material(e.g., SiO₂), and the charge blocking element may include an oxidematerial (e.g., instead of OR—SiON). The cell design illustrated in FIG.6 may be operable at Vpp=+/−7 V, with an EOT of approximately 9.1 nm,for low cost, high capacity, and durability. The cell design may have alarge memory window, which may provide TLC capability. Although the L2functionality may be relatively slower, the L4-L5 functionality may beaccentuated by the large memory window and enhanced charge retention.

For example, FIG. 6 illustrates a partial energy band diagram of thegate stack structure of a reverse-mode multifunctional memory cell 6039.Cell 6039 can be, for instance, a six unique layer low cost, highcapacity memory cell that can provide both L2-L3 and L4-L5functionality, while being cheap and/or easy to process (e.g.,fabricate). In an embodiment, cell 476 can comprise a stack thatincludes a charge blocking element having an oxide material, an HfSiONmaterial, an Al₂O₃ material, and an i-SRN material, a GaN non-volatilecharge storage element, a nitride less non-volatile charge storageelement, and a charge transport (e.g., tunnel) element having an HfSiONmaterial and an oxide material, as will be described herein.

As shown in FIG. 6, cell 6039 can include a substrate element 6051, acharge blocking element 6049 adjacent (e.g., in direct contact with)substrate element 6051, a non-volatile charge storage element 6047adjacent charge blocking element 6051, a less non-volatile chargestorage element 6045 adjacent non-volatile charge storage element 6047,a charge transport (e.g., tunneling) element 6043 adjacent lessnon-volatile charge storage element 6045, and a gate element 6041adjacent charge transport element 6043. Substrate element 6051 can be,for example, a silicon material, and gate element 6041 can be aninsulator-metal interface material (e.g., layer) such as, for instance,TaN or TiN.

Less non-volatile (e.g., DRAM) charge storage element 6045 can be anitride material, and non-volatile (e.g., flash) charge storage element6047 can be a GaN material, which can both have characteristics andbenefits analogous to those previously described in connection with FIG.4. GaN material 6047 and nitride material 6045 can have thicknesses of 5nm and 2 nm, respectively, with a combined EOT of approximately 2.6 nm.

As shown in FIG. 6, charge blocking element 6049 can include a firstmaterial 6063, a second material 6061, a third material 6059, and afourth material 6057. First material 6063 can be an oxide material, andsecond material 6061 can be a hafnium oxynitride material (e.g.,HfSiON). Oxide material 6063 and HfSiON material 6061 can havethicknesses of 1 nm and 4.5 nm, respectively, with a combined EOT of 2.3nm.

Third material 6059 can be an Al₂O₃ material, and fourth material 6057can be a silicon-rich nitride (e.g., i-SRN) material, which can bothhave characteristics and benefits analogous to those previouslydescribed in connection with FIG. 4. Al₂O₃ material 6059 and i-SRNmaterial 6057 can have thickness of 2 nm and 4 nm, respectively, with acombined EOT of approximately 2 nm.

In the example illustrated in FIG. 6, charge transport element 6043includes a first material 6055 and a second material 6053. Firstmaterial 6055 can be a hafnium oxynitride material (e.g., the same typeof hafnium oxynitride material as material 6061) having characteristicsand benefits analogous to those previously described in connection withFIG. 4, and second material 6053 be an oxide material such as, forinstance, SiO₂. HfSiON material 6055 can have a thickness of 2.5 nm, andoxide material 6053 can have a thickness of 1.5 nm, with a combined EOTof approximately 2.2 nm for charge transport element 6043.

During operation of cell 6039, such as, for instance, during a programoperation being performed on cell 6039, a charge (e.g., an electron) maybe transported from gate element 6041 through charge transport element6043 (e.g., through materials 6053 and 6055) by enhanced directtunneling (e.g., PBO DTM) to less non-volatile charge storage element6045 or non-volatile charge storage element 6047. For instance, aprogram operation performed on cell 6039 can include applying a program(e.g., write) voltage (+/−Vpp) to cell 6039, and the charge storageelement to which the charge is transported during the program operationmay depend on the duration for which the program voltage is applied tothe cell.

The charge may be transported through charge transport element 6043 by,for instance, tunneling through charge transport element 6043. Forexample, charge transport element 6043 can be a double layer PBO tunnelbarrier that can provide internal field-aided enhanced electrontransport, and the charge may tunnel through the PBO tunnel barrier viadirect electron tunneling. The charge can then be trapped and stored bythe charge storage element to which it has been transported, and chargeblocking element 6049 can prevent the stored charge from leaking whileit is being stored. When the gate polarity is reversed for erasing,enhanced tunneling of the charges from the charge storage elements maytake place through the above-mentioned direct tunnel (PBO-DTM) barriersback to gate element 6041.

One characteristic of reverse-mode MSUM cell designs described herein isthe application of multiple trapping dielectric materials with intrinsictrapping properties of trap density (often expressed in terms of captureprobability) and trap energy depth and placement of such materials withreference to the charge sources, (e.g., the gate) and the semiconductorsubstrate (e.g., silicon) of the NVM gate stack design. Wellcharacterized trapping dielectric (e.g., nitride) along with deep offsettrapping dielectric (e.g., GaN) have been used and placed appropriatelyin the reverse-mode MSUM cell designs to achieve simultaneousmultifunctionality with desirable performance in the reverse-mode MSUMdevice illustrations discussed earlier. The significance of specificreverse-mode MSUM cell stack design to efficiently inject and storecharges deriving appropriate memory properties (e.g., window, retention,endurance, durability, MLC-capability, multi-functionality) has beendescribed herein. By placing multiple trapping dielectric materials withdifferent trapping properties at variable distances from charge sources,a variable functionality with variable performance could be achieved,which can be tuned to pulsing schemes [(+/−Vpp) and pulse durations)] toachieve simultaneously desired multi-functionality and performancecharacteristics for the reverse-mode MSUM cell. The following celldesign addresses such a reverse-mode MSUM design by incorporatingultra-thin film laminates of inter-combed nitride and i-SRN materialsplaced between the tunneling layers and the blocking layer (or layers)for the reverse-mode MSUM cell stack design. The scheme could beextended to incorporate triple-material laminates comprisinginter-combed trapping storage layers of, for instance, i-SRN (storage),nitride (shallower trap), and GaN (deeper trap) to achieve variousdesign objections and multifunctionality. Many variations of such schemeare possible but will not be specifically illustrated here. A singularexample will be described herein in connection with FIG. 7.

FIG. 7 illustrates a portion of a multifunctional memory cell 7065 inaccordance with an embodiment of the present disclosure. For example,FIG. 7 illustrates a stack design concept for a variable (e.g., L2-L3and L4) functionality, variable performance reverse-mode MSUM designcomprising multiple layering of two materials (e.g., nitride with ashallower trap, and i-SRN) adjacent to each other as inter-combedlaminates in the form of a partial energy band diagram.

The stack design illustrated in FIG. 7 can be an extension of the memorycell designs previously described in connection with FIGS. 5 and 6. Forexample, a two or three-layer PBO barrier can be combined with extendedtrapping laminations of successive thin (e.g., 1-2 nm thick) layers ofnitride or Si₂ON₂ paired with i-SRN, with at least three pairs oftrapping-storage layer designs for variable L2-L3 functionality. Sincethe trapping storage distances for the relatively shallower traps of thenitride material (e.g., as compared to GaN) would vary, the performanceof L2 and L3 designs can be varied for different applications, power,and/or performance. Stack structures for both Vpp=+/−5 V and +/−7 Vcould be achieved by using the appropriate number of pairs oftrap-storage laminates in the design, and such designs may (or may not)incorporate L4-L5 MLC capabilities. The stack design illustrated in FIG.7 can comprise four pairs of nitride (or Si₂ON₂) and i-SRN layers, each1.5 nm thick, with L4 SLC operability at Vpp=+/−7 V and relativelyhigher performing variable performance L2-L3 functionality withoutdeep-offset trapping.

Cell 7065 can comprise, for example, a triple-layered tunneling design7069, with multiple pairs of nitride-i-SRN laminates 7071 for chargestorage placed between charge transport element 7069 and charge blockingelement 7073. By trapping and storing charges at different locations anddetrapping such charges through a write-erase pulsing scheme, differentfunctionality and associated performance such as L2-L3 and L4 SLC or MLCfunctionality can be simultaneously achieved.

In the example shown in FIG. 7, a three-layered direct tunneling PBObarrier 7069 is illustrated, comprising a silicon-rich nitride material(e.g., i-SRN) 7077, an HfO₂ material 7079, and a hafnium oxynitridematerial (e.g., HfLaON) 7081. The charge storage design 7071 illustratedcomprises, for example, four pairs of thin laminates, each comprisingnitride material 7083 and silicon-rich nitride material (e.g., i-SRN)7085. The charge blocking element 7073 comprises a thicker layer of thethermally stable, low leakage HfLaON material 7087 adjacent to 7017, anda thin layer of SiO₂ material 7089, to provide for simultaneous storageof at least 3 bits for multilevel memory (e.g., 8 memory states for TLCmemory) with L2, L3, and L4 functionality.

As shown in FIG. 7, cell 7065 can include a substrate element 7075adjacent (e.g., in direct contact with) charge blocking element 7073,charge storage element 7071 adjacent charge blocking element 7073,charge transport (e.g., tunneling) element 7069 adjacent charge storageelement 7071, and a gate element 7067 adjacent charge transport element7069. Substrate element 7075 can be, for example, a silicon material,and gate element 7067 can be an insulator-metal interface material suchas, for instance, TaN or TiN.

As shown in FIG. 7, charge storage element 7071 can include a number ofalternating nitride materials 7083 and i-SRN materials 7085corresponding to different memory levels. For instance, charge storageelement 7071 can include a first nitride material adjacent chargetransport element 7069, a first i-SRN material adjacent the firstnitride material, a second nitride material adjacent the first i-SRNmaterial, a second i-SRN material adjacent the second nitride material,and so on. Utilizing nitride and i-SRN materials in charge storageelement 1269 can have benefits analogous to those previously describedherein.

In the example illustrated in FIG. 7, charge transport element 7069includes a first material 7077, a second material 7079, and a thirdmaterial 7081. First material 7077 can be an i-SRN material, secondmaterial 7079 can be an HfO₂ material, and third material 7081 can be ahafnium oxynitride material (e.g., the same hafnium oxynitride materialas 7087). Utilizing such materials in charge transport element 7069(e.g., as a direct tunneling PBO barrier) can have benefits analogous tothose previously described herein.

During operation of cell 7065, such as, for instance, during a programoperation being performed on cell 7065, a charge (e.g., electron) may betransported from gate element 7067 through charge transport element 7069(e.g., through first material 7077, second material 7079, and thirdmaterial 7081) to one of the nitride materials 7083 of charge storageelement 7071. The charge may be transported through charge transportelement 1268 by, for instance, direct tunneling through charge transportelement 7069, in a manner analogous to that previously described herein.

As an example, a program operation performed on cell 7065 can includeapplying a program (e.g., write) voltage to cell 7065, and which nitridematerial 7083 (e.g., which memory level) the charge is transported toduring the program operation may depend on the duration for which theprogram voltage and duration of the program pulse is applied to thecell. The charge can then be trapped and stored in the material (e.g.level) to which it is transported. For erasing, the program potentialand pulse characteristics at the gate would be reversed for de-trappingthe charges. The programming and erasing for different levels may befast from trapping and de-trapping from the nitride materials at tunneldistances closest to gate element 7067, and may be successively longerfrom trapping and de-trapping at increasing tunnel distances.

FIG. 8 illustrates a memory array 8108 having multifunctional memorycells in accordance with an embodiment of the present disclosure. Forinstance, array 8108 can include reverse-mode multifunctional memorycells previously described herein in connection with any of FIGS. 3-7.Array 8108 can be, for instance, a three-dimensional array in which themultifunctional memory cells are vertically stacked, planarmultifunctional memory cells.

As shown in FIG. 8, array 8108 can include access (e.g., word) lines8135-8137 that extend in the x-direction, and data (e.g., bit) lines8131-8133 that extend substantially perpendicular in the y-direction. Amultifunctional memory cell in accordance with the present disclosurecan be located at the intersection of each respective word line and bitline, as illustrated in FIG. 8.

Isolation areas 8140, 8141 can be formed between the bit lines 8131,8132 and 8132, 8133, respectively, while isolation areas 8142, 8143 canbe formed between the word lines 8135, 8136 and 8136, 8137,respectively. A common source line can be formed in the memory array andcommonly coupled to the bit lines 8131, 8133 for devices on either side(left or right).

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of a number of embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of ordinary skill in the artupon reviewing the above description. The scope of a number ofembodiments of the present disclosure includes other applications inwhich the above structures and methods are used. Therefore, the scope ofa number of embodiments of the present disclosure should be determinedwith reference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. A memory cell, comprising: a gate element; afirst charge storage element, wherein the first charge storage elementincludes a nitride material; and a second charge storage element,wherein the second charge storage element includes a gallium nitridematerial; wherein: the gate element is configured to transport a firstcharge therefrom to the first charge storage element and transport asecond charge therefrom to the second charge storage element; the firstcharge storage element is configured to, subsequent to the first chargebeing transported from the gate element thereto, transport the firstcharge therefrom to the gate element; and the second charge storageelement is configured to, subsequent to the second charge beingtransported from the gate element thereto, transport the second chargetherefrom to the gate element.
 2. The memory cell of claim 1, wherein:the first charge storage element is configured to store the firstcharge; and the second charge storage element is configured to store thesecond charge.
 3. The memory cell of claim 1, wherein the first chargestorage element is a volatile charge storage element.
 4. The memory cellof claim 1, wherein the first charge storage element is a non-volatilecharge storage element.
 5. The memory cell of claim 1, wherein thesecond charge storage element is a non-volatile charge storage element.6. A method of operating a memory cell, comprising: transporting a firstcharge from a gate element of the memory cell to a first charge storageelement of the memory cell, wherein the first charge storage elementincludes a nitride material; transporting a second charge from the gateelement to a second charge storage element of the memory cell, whereinthe second charge storage element includes a gallium nitride material;transporting, subsequent to transporting the first charge from the gateelement to the first charge storage element, the first charge from thefirst charge storage element to the gate element; and transporting,subsequent to transporting the second charge from the gate element tothe second charge storage element, the second charge from the secondcharge storage element to the gate element.
 7. The method of claim 6,wherein the method includes storing, by the first charge storageelement, the first charge, and storing, by the second charge storageelement, the second charge.
 8. The method of claim 7, wherein the methodincludes preventing leakage of the stored charges.
 9. The method ofclaim 6, wherein the gate element includes a tantalum nitride material.10. The method of claim 6, wherein the method includes: transporting thefirst charge through a charge transport element of the memory cell tothe first charge storage element; and transporting the second chargethrough the charge transport element to the second charge storageelement.
 11. The method of claim 10, wherein transporting the firstcharge and the second charge through the charge transport elementincludes tunneling the first charge and the second charge through thecharge transport element.
 12. The method of claim 6, wherein the methodincludes transporting the first charge to the first charge storageelement and the second charge to the second charge storage elementduring a program operation being performed on the memory cell.
 13. Themethod of claim 6, wherein the method includes transporting anadditional charge to a third charge storage element of the memory cell.14. A memory cell, comprising: a gate element; a volatile charge storageelement, wherein the volatile charge storage element includes a nitridematerial; and a non-volatile charge storage element, wherein thenon-volatile charge storage element includes a gallium nitride material,wherein: the gate element is configured to transport a first chargetherefrom to the volatile charge storage element and transport a secondcharge therefrom to the non-volatile charge storage element; thevolatile charge storage element is configured to, subsequent to thefirst charge being transported from the gate element thereto, transportthe first charge therefrom to the gate element; and the non-volatilecharge storage element is configured to, subsequent to the second chargebeing transported from the gate element thereto, transport the secondcharge therefrom to the gate element.
 15. The memory cell of claim 14,wherein the memory cell includes a charge blocking element configuredto: prevent leakage of a charge stored by the volatile charge storageelement; and prevent leakage of a charge stored by the non-volatilecharge storage element.
 16. The memory cell of claim 15, wherein thememory cell includes a silicon substrate element adjacent the chargeblocking element.
 17. The memory cell of claim 15, wherein the chargeblocking element includes a hafnium oxynitride material.
 18. The memorycell of claim 14, wherein the nitride material is a silicon oxynitridematerial.